Event

Tue, Oct 06

Bondexpo

06. - 08.10.2026 Stuttgart Bondexpo Bondexpo 2026, scheduled for October 6–8 at Messe Stuttgart, is set to be a premier event dedicated to adhesive bonding, sealing, potting, and foaming technologies. The exhibition will provide a comprehensive platform for professionals across industries to explore innovations in joining and bonding processes, exchange knowledge, and discover practical solutions for modern manufacturing challenges. With a focus on precision, efficiency, and sustainability, Bondexpo 2026 will showcase the latest equipment, materials, and techniques that are shaping the future of adhesive and bonding technologies. Among the leading exhibitors, Henkel will present its advanced adhesive and bonding solutions, Sika will highlight its innovative sealing and structural bonding technologies, and 3M will showcase its cutting-edge industrial adhesives and surface solutions. Their participation underscores the event’s role as a hub for innovation, offering attendees the opportunity to engage with top-tier companies and gain insights into the latest trends and developments in bonding and assembly processes.

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Bondexpo